Material:
• Pre-Solder: Au-Sn pre-solder AU-SN8020.
• Lid Plate: Gold-plated lid plates 4J42/4J29.
Airtightness:
• Helium Leak Rate: 510^-9 PAM^3/S ≤
Quality and Inspection Results:
• Alignment: The offset between the Au-Sn ring and the lid plate is less than 0.05mm.
• Solder Spillage: No apparent spillage around the solder joint.
• Solder Melt: After melting, the solder around the edges is fully melted and continuous, with a bright appearance.
• X-Ray Inspection: Cavity rate less than 15% with no through-holes.