micro-blog
hotline：18960611011
fj_cxwdz@qq.com
Home
PRODUCT
IC Service Series
Shell series
Accessories series
News
Company
Industry
About
Advantage
Partner
Contact
Language
简体中文
English
PRODUCT
Position：
Home
>
PRODUCT
>
IC Service Series
Shell series
Accessories series
Ceramic Package
Low thermal resistance plastic packaging
Plastics Package (TO, HSIP, HZIP)
IC Module Package
Ceramic Lid (glass frit sealing)
Ceramic Leaded Chip Carrier (CLCC)
Ceramic Flat Pack (CFP)
Lead Frame
Black Ceramic Flat Pack with Low-temp Glass Frit Sealing
Black Ceramic DIP (Low-temp Glass Frit Sealing)
Black Ceramic Flat Pack with Low-temp Glass Frit Sealing
Low-Temperature Glass Frit Powder
AU-Sn Lid
Zinc white copper folding cover
Nickel plated upper cover
Gold plated cover
Copper coated aluminum bonding transition piece
Copper gold-plated transition piece
23 Totals
1
2
Next
