PRODUCT_Fujian Chuangxin Microelectronics Co., Ltd

> PRODUCT_Fujian Chuangxin Microelectronics Co., Ltd

Ceramic Package

Low thermal resistance plastic packaging

Plastics Package (TO, HSIP, HZIP)

IC Module Package

Ceramic Lid (glass frit sealing)

Ceramic Leaded Chip Carrier (CLCC)

Ceramic Flat Pack (CFP)

Lead Frame

Black Ceramic Flat Pack with Low-temp Glass Frit Sealing

Black Ceramic DIP (Low-temp Glass Frit Sealing)

Black Ceramic Flat Pack with Low-temp Glass Frit Sealing

Low-Temperature Glass Frit Powder

AU-Sn Lid

Zinc white copper folding cover

Nickel plated upper cover

Gold plated cover

Copper coated aluminum bonding transition piece

Copper gold-plated transition piece

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