The black ceramic low-temp glass grit sealing DIP is a type of electronic packaging that offers excellent hermeticity and high corrosion resistance. Currently, this package is available in various specifications and models ranging from 8 to 40 pins, as detailed in the "Specification Sheet for Black Ceramic DIP Substrates".
• Packaging Process: Glass frit sealing
• Process Features: Suitable for small batch production with a quick and simple process.
• Thermal Management: The package provides good heat dissipation and high thermal conductivity.
• Base: Offers a selection of cavity sizes to suit different specifications.
• Cavity: Available with or without gold plating.
• Lid: Standard lids and lids with optical windows are available.
• Performance: High reliability.
• Excellent hermeticity & high corrosion resistance