Ceramic Leaded Chip Carrier (CLCC)

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  • CQFN Performance Advantages:

  Excellent electrical and thermal performance suitable for high-speed, high-frequency applications.

  • Design Characteristics:

  Small size, lightweight, low self-inductance, and minimal internal wiring resistance enhancing electrical performance.

  • Applications and Capabilities:

  Ideal for package surface acoustic wave devices, RF and microwave components due to robust structure and efficient heat dissipation. Supports advanced technology applications requiring high performance and reliability.