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Plastic packaging
 Position： Home >PRODUCT > IC Service Series > Plastic packaging >
  • Chip trade
  • Tin dipping processing
  • Ceramic packaging
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  • Encapsulated power module
Low thermal resistance plastic packaging
Plastics Package (TO, HSIP, HZIP)
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Mobile：18960611011
Phone：18960617388
Mailbox：fj_cxwdz@qq.com
Address：Third generation semiconductor digital industrial park project on Xinyuan Road, Nanyu Town, Fuzhou High tech Zone

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　　Fujian Chuangxin Microelectronics Co., Ltd. was established in 2020 and is a leading high-tech enterprise worldwide, focusing on innovation and appl...

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 Third generation semiconductor digital industrial park project on Xinyuan Road, Nanyu Town, Fuzhou High tech Zone
 18960617388
 18960611011
 fj_cxwdz@qq.com

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